Integrated sub-micron vacuum gaps in semiconductor devices
نویسندگان
چکیده
We present characterization results of integrated vacuum gaps in semiconductors and report the highest breakdown field dielectric layers ever recorded within microfabricated semiconductor devices. Difficulties associated with presence high electric fields could be overcome by using cylindrical capacitors silicon electrodes that were manufactured standard technology. With this approach, up to 6 × 10 9 V/m achieved. The 175(5) nm significantly smaller than mean free path electrons gap such a due avalanche discharge was avoided. As voltage increased, initially emission current observed followed Fowler–Nordheim tunneling behavior. started increase at voltages about four times greater as compared equivalent oxide. At higher voltages, mechanical occurred, where pillars formed central electrode capacitor snapped electrostatic forces. provide characteristics thin layers, which useful for device design micro- nanoelectromechanical systems well
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ژورنال
عنوان ژورنال: Applied Physics Letters
سال: 2022
ISSN: ['1520-8842', '0003-6951', '1077-3118']
DOI: https://doi.org/10.1063/5.0097043