Integrated sub-micron vacuum gaps in semiconductor devices

نویسندگان

چکیده

We present characterization results of integrated vacuum gaps in semiconductors and report the highest breakdown field dielectric layers ever recorded within microfabricated semiconductor devices. Difficulties associated with presence high electric fields could be overcome by using cylindrical capacitors silicon electrodes that were manufactured standard technology. With this approach, up to 6 × 10 9 V/m achieved. The 175(5) nm significantly smaller than mean free path electrons gap such a due avalanche discharge was avoided. As voltage increased, initially emission current observed followed Fowler–Nordheim tunneling behavior. started increase at voltages about four times greater as compared equivalent oxide. At higher voltages, mechanical occurred, where pillars formed central electrode capacitor snapped electrostatic forces. provide characteristics thin layers, which useful for device design micro- nanoelectromechanical systems well

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

CMOS Semiconductor Manufacturing Integration on Sub-micron Gate Spacer

This paper describes the details of a novel manufacturing process integration of CMOS (Complementary Metal-Oxide-Semiconductor) transistor architecture, which is incorporated into a sub-micron logic technology on 300mm wafers. As the gate length is scaling down, the spacer design for CMOS transistor becomes increasingly important especially for high performance. Experimental manufacturing proce...

متن کامل

Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design

Several regular circuit structures are proposed. They provide alternatives to the widely used standard-cell structure and have better predictability and a simpler design methodology. A regular global routing scheme is developed. A design flow for use with of all these regular fabrics is discussed.

متن کامل

Oxynitride Gate Dielectrics for Deep Sub-micron MOS Devices

The continuous demand for improved CMOS transistors necessitate smailer device dimensions. The reduction in chip size into the deep sub-micron dimensions opens up new scientific and engineering challenges. One of the most critical material in developing deep sub-micron MOS transistors is high quality ultrathin (a few nm) gate dielectric film. As the gate dielectric thickness is reduced to below...

متن کامل

Numerical analysis of deep sub-wavelength integrated plasmonic devices based on Semiconductor-Insulator-Metal strip waveguides.

We report the first study of nanoscale integrated photonic devices constructed with semiconductor-insulator-metal strip (SIMS) waveguides for use at telecom wavelengths. These waveguides support hybrid plasmonic modes transmitting through a 5-nm thick insulating region with a normalized intensity of 200-300 μm(-2). Their fundamental mode, unique transmission and dispersion properties are consis...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Applied Physics Letters

سال: 2022

ISSN: ['1520-8842', '0003-6951', '1077-3118']

DOI: https://doi.org/10.1063/5.0097043